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TAP TIMES       -19-                                OCTOBER 2022



                 Paradigm shift (from 18)                       ODMs are entering packaging & assembly,
                                                                cannibalizing the OSAT business.
        ages and embedded dies (and passives) in
        organic substrates in response to the ac-               Substrates have been in tight supply due
        celerated adoption of fan-out packaging.                to strong demand for high-end CPUs,
                                                                GPUs, and 5G networking chips by major
        Substrate know-how                                      chipmakers.
        These players are taking advantage of
        their substrate manufacturing know-how,                 The COVID-19 pandemic, high inflation,
        panel line and equipment availability, and              and geopolitical tensions are continuing to
        thin RDL technology development.                        negatively impact material supplies.


        On the other hand, OSATs are expanding                  Extended lead times
        their testing expertise, while traditional              The delivery lead time of ABF substrates
        pure test players are investing in packag-              has been extended to nearly three quar-
        ing & assembly capabilities.                            ters from 4-5 months due to demand
                                                                growth outpacing capacity expansion, and
        Test expansion                                          prices have risen from 15% to 25%.
        Top OSATs are investing in IC testing ca-
        pacity to capture the test market, and                  Key points, Yole reports:
        pure test houses, such as KYEC and Sigurd               -The advanced packaging industry is ex-
        Microelectronics, are adding packaging/as-              pected to have a 9.6% CAGR between
        sembly capabilities in their service offering           2021 and 2027 to $65 billion.
        through M&As or investing in R&D.
                                                                -The advanced packaging segment as
        Overall, there is a paradigm shift in the               compared with traditional packaging mar-
        packaging / assembly business, tradition-               ket continues to increase, with more than
        ally the domain of OSATs & IDMs. Players                50% of the market by 2027.
        from different business models, foundries,
        substrate/PC board suppliers and EMS/                   Flip-Chip has highest market share
                                                                                The highest CAGR is expect-
                                                                                ed from ED , 2.5D/3D, and
                                                                                fan-out at 24%, 14%, and
                                                                                11%, respectively.


                                                                                The semiconductor supply
                                                                                chain is changing. Compa-
                                                                                nies define their strategies at
                                                                                various levels to adjust to the
                                                                                changing business environ-
                                                                                ment. They are moving all
                                                                                along the supply chain with
                                                                                different business models.
                                                                                They expand the business
                                                                                and explore new areas.
                                                                                                yolegroup.com
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