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TAP TIMES -18- OCTOBER 2022

M&A agreements (from 16) The four largest semiconductor acquisition
agreements in 1H22 accounted for essen-
attempt to buy processor-design intellec- tially all of the $20.6 billion in M&A value
tual property (IP) supplier ARM in the U.K. during the first half of this year, the new
from Japan’s SoftBank for $40 billion in update said.
cash and stock.
Several other smaller semiconductor ac-

Nvidia dropped its purchase of ARM in Feb- quisition agreements were struck in 1H22,
ruary 2022 after facing opposition by gov- but these deals had values under $25 mil-
ernment regulators in the U.S., U.K., and lion.
European Union over anti-trust concerns. icinsights.com

Paradigm shift in the packaging and assembly business: Yole Group

LYON, France — Six players, includ- process over 80% of advanced packaging
ing two IDMs (Intel and Samsung), wafers. OSATs accounted for 65% of the
a foundry (TSMC), and the top three advanced packaging wafers in 2021.
global OSATs (ASE, Amkor, JCET),
Taking business
Foundries are taking
advanced packaging
business from OSATs
with 14% and IDMs
with 21%.

IC substrate and
PC board manufac-
turers, including
SEMCO, Unimicron,
AT&S, and Shinko,
are entering the
advanced packaging
arena.

They offer panel-
level fan-out pack-
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