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TAP TIMES -35- OCTOBER 2022
Last year set revenue records followed by SUSS MicroTec, which is gain-
for lithography, bonding tools ing recognition for memory thinning.
LYON, France — 2021 was yet another Flip-chip equipment
consecutive record revenue year for Finally, D2W hybrid bonding requires die
lithography and bonding equipment attach or flip-chip equipment type from
vendors, despite ongoing supply chain players such as Besi, Shibaura, Smart
issues. Equipment Technology and ASM Pacific
Technology for instance.
Canon, ASML market leaders
Canon is the lithography market leader fol- Among them, although Besi is a newcomer
lowed closely by ASML. EVG is the market it is the market leader, followed by Shibau-
leader for both W2W permanent and tem- ra, whose tools have been used for this
porary bonding. application for several years.
In the W2W permanent bonding business, Looking forward, we expect positive equip-
EVG is followed by Tokyo Electron Limited ment market growth with a reasonable
(TEL), both serving CIS as well as 3D inte- 8% CAGR for 2020-2027. The market will
gration and stacking. reach $2.8B in 2027, driven by increasing
wafer volumes to be processed across all
In the temporary bonding business, EVG is applications considered. yolegroup.com
