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TAP TIMES -46- NOVEMBER 2022
Top 10 (from 45)
are focused on diversifying development of
special processes and have develop tech-
nology platforms including HV (High Volt-
age), Analog, Mix-signal, eNVM, BCD, and
RF from logic processes.
These are used to professionally produce
peripheral ICs such as power management TrendForce says the global automotive industry is trending to-
ICs, driver ICs, microcontrollers (MCU), ward Connected-Automated/Autonmous-Shared-Electric (C-A-S-
and RF (Radio Frequency) required in the E automobiles. (Honda)
fi elds of smart phones, consumer electron- in vehicle telematics systems and SoCs for
ics, high-performance computing, automo- self-driving computing. Due to the com-
tive, and industrial computing. plexity of automotive functions, the 32-
Bit MCU type ECU has become the main-
Specifi c purposes stream specifi cation in the market.
As 5G communication, high-performance
computing, new energy vehicles, and au- In 2023, its penetration rate will exceed
tomotive electronics usher in a trend of in- 60% with a market value reaching $7.4
creased special semiconductor component billion and it will develop towards process-
consumption, it is imperative for these ap- es below 28nm (inclusive).
plications to rely on support from diverse
specialized processes to achieve the spe- High-performance computing needed
cial purposes required in various fi elds. In addition, self-driving cars require high-
performance computing AI SoCs and
2. Development trends continue to develop towards advanced
The global automotive industry is trending processes below 5nm (inclusive) with com-
towards C-A-S-E, driving strong demand puting power reaching 1,000 TOPS and,
for automotive semiconductors. along with MCUs, these products will ac-
celerate the upgrade of the global automo-
Two categories tive industry.
Automotive semiconductors are essentially
divided into two categories: IDM and Fab- With the rapid rise of 800V automotive
less. electric drive systems, high-voltage DC
charging piles, and high-effi ciency green
As traditional automotive chip suppliers, data centers, SiC and GaN power compo-
IDMs off er a fairly complete selection of nents have entered a stage of rapid devel-
various ECUs and have gradually evolved
from a traditional distributed architecture opment.
to Domain Control Unit (DCU) and Zone
Control Unit (ZCU) architectures. GaN, SiC power devices
TrendForce predicts that from 2022 to
Fabless, on the other hand, continue to fo- 2026, the compound annual growth rate of
cus on the fi eld of high-performance com- the SiC and GaN power device market will
puting for vehicles and the development reach 35% and 61%, respectively.
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