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TAP TIMES -45- NOVEMBER 2022

TrendForce announces Top 10 facturing have diverged. TSMC continues

tech trends for 2023 (Part 1) utilizing FinFET structure in mass-pro-
duced 3nm products in 2H22, which will be
officially released in 1H23, with the scale
TAIPEI, Taiwan — Industry consultant
TrendForce has published its annual of mass production increasing quarter by
listing of Top 10 technology trends for quarter.
2023.
In 2023, TSMC 3nm products will include
PC CPU and smartphone SoC. Samsung
1. Pure foundry processes
Pure foundry processes transitioned from began introducing the GAAFET-based MB-
Planar Transistor to the FinFET generation CFET architecture (Multi-Bridge Channel
starting from the 16nm node. Field-Effect Transistor) at 3nm and this
process will begin mass-production in
2022.
After the development of the 7nm process
and the introduction of EUV lithography Cryptocurrency chip
technology, FinFET structure encountered
physical limits at the 3nm node. Since Its first-generation product is a cryptocur-
then, the two leaders in advanced manu- rency mining chip. In 2023, Samsung will
will focus on sec-
ond generation
3nm processes,
with a goal of
mass-producing
smartphone SoCs.

Both companies
remain focused on
high-performance
computing and
smart phone plat-
forms in the ini-
tial stage of 3nm
mass production
as these prod-
ucts have higher
requirements for
improving perfor-
mance, lowering
power consump-
tion, and reducing
chip area.

For mature pro-
cesses above
28nm, foundries
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