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TAP TIMES -31- JANUARY 2022
Intel shows and tells key tech This, says Intel, will provide an order of
advances at IEDM meet magnitude increase in the interconnect
density for 3D stacking.
SAN FRANCISCO — At the December New industry standards
International Electron Devices Meet- To enable the ecosystem to gain benefits
ing, Intel unwrapped what it termed of advanced packaging, Intel is also call-
breakthroughs in chip packaging, ing for the establishment of new industry
transistors and quantum physics. standards and testing procedures to en-
able a hybrid bonding chiplet ecosystem.
10X density improvement
These advances, according to Intel, are on Looking beyond its gate-all-around Rib-
the path to a 10X interconnect density im- bonFET, Intel is mastering the coming
provement in packaging with hybrid bond- post-FinFET era with an approach to stack-
ing; 30-50% area improvement in transis- ing multiple (CMOS) transistors that aims
tor scaling; and new concepts in physics. to achieve a maximized 30% to 50% logic
scaling improvement for the continued ad-
Intel, the company says, is pursuing sig- vancement of Moore’s Law by fitting more
nificant research in essential scaling tech- transistors per square millimeter.
nologies for delivering more transistors in
future product offerings: Intel is also paving the way for Moore’s
Law advancement into the angstrom era
Some of Intel’s future plans were an- with forward-looking research showing
nounced at an Intel event last July, when how novel materials just a few atoms thick
the company introduced Foveros Direct, can be used to make transistors that over
enabling sub-10-micron bump pitches. next page
Intel is also calling for the establishment
of new industry standards and testing pro-
cedures to enable a hybrid bonding chiplet
ecosystem.
Looking beyond its gate-all-around Rib-
bonFET, Intel is mastering the coming
post-FinFET era with an approach to stack-
ing multiple (CMOS) transistors that aims
to achieve a maximized 30% to 50% logic
scaling improvement for the continued ad-
vancement of Moore’s Law by fitting more
transistors per square millimeter.
Intel is also paving the way for Moore’s
Law advancement into the angstrom era
