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October 2022 — Contents
FEATURES
Adapting contactor probles for high-power 13-CMOS image sensors stall in “Perfect Storm”
16-Demand for wearables slowed in Q222
QFN devices. Managing heat transfer in high-cur- 16-Intel selects Italian site for packaging facility
rent test sockets requires careful attention to many 18-Paradigm shift in assembly and packaging
factors including test program control and sense 20-Global smartphone production fell in first half
feedback, Ron Lesnikoski, 3 22-DRAM market deflates says IC Insights
24-Smartphone shipments likely to fall
Intel holds groundbreaking for $20 billion 25-Decline seen for PCs, tablets
megafab. President Biden was among the high- 26-Lead-free solar material offers simpler process
profile visitors at the recent ceremony to mark In- 29-Battery discovery may impact grid, vehicles
34-Elizabeth Holmes’ sentencing postponed
tel’s newest fab site in Ohio, which may eventually 35-Last year set record for litho, bonding tools
represent a $100 billion investment for Intel, 15 38-TSMC jumps to first place in growth
Four large M&A agreements marked the first Events 21
half of the year. The pace of megadeals for Advertisers, 26
semiconductor mergers and acquisitions regained Business Cards, 30-31
momentum in the first six months of 2022, 17 Socket Buyer’s Guide, 36-37
Scientists demonstrate s fully biodegradable Cover: Intel’s D1D/D1X facility in Hillsboro, Oregon, one of the company’s
U.S. fab locations (The others are in Arizona and New Mexico), may be the
and recyclable PC board. A team of researchers model for the new Oiio megasite. Overall, CEO Patrick Gelsinger said that
have developed a potential solution to the electron- the megasite may ultimately represent an investment of more than $100
billion. (Intel) photo
ics waste problem, 32
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12-Market for test consumables $7.5B by 2027
