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TAP TIMES -16- OCTOBER 2022
JANUARY 2023
TAP TIMES -10-
will melt. Great care must be taken in the
SIA report (from 15)
High-power socket design (from 8) Ensuring global markets remain as open
test program, sense feedback loop and
as possible will benefit the U.S., which
The heat transfer and convection cooling in
test cell operation to prevent over current
The public and private sectors must work gains significantly from free trade and has
this area is poor, so there is little external
together to encourage more domestic the most to lose in the face of restrictions.
conditions lasting more than 50ms.
relief for the current/temperature function.
workers to enter the field of design, as
well as to prevent experienced designers To maintain U.S. semiconductor leader-
Probe lifetime
More robust materials
from leaving the field or the country. ship in the coming decade and continue
The lifetime of the probes under high-cur-
Increasing the contact surface area, lower- to develop the semiconductors critical for
rent loads also diminishes as the contact
The private sector must continue to en- the innovation so many industries rely on,
ing contact resistance, and adding more
resistance increases.
hance the productivity of its workforce by the report finds the U.S. private sector will
robust materials for the probe tip are the
adopting new tools and prioritizing the need to invest $400 billion to $500 billion
main ways to address the issue.
With high temperature (usually >250°C)
highest value-add R&D and design. in design over the next 10 years.
at the tips of the probe, tin migrates to the
The expectation though is that the mate- surface of the probes. Aggressive abrasive
3. Open access to global markets is Stronger tax incentives
rial and the operation of the probe will be
cleaning can reduce the eff ects of the tin
under pressure This can be incentivized through an in-
degraded if high currents are regularly
migration but adds to the tip wear
Investment in R&D is funded by sales, creased R&D tax incentive. America’s cur-
driven through the probe.
and smooths the asperities needed to
and today, tariffs, export restrictions, and rent incentive is weaker than incentives of-
make good contact.
other factors threaten market access for fered by our global competitors and should
In some conditions, the probe may be
U.S. semiconductor players, implicitly put- be strengthened.
destroyed as well as the surrounding PC
semiconductors.org
ting R&D reinvestment at risk. Increasing the contact force of the com-
board and socket plastic material, which next page
High Connection Density, Inc.
542 Gibraltar Dr., Milpitas, CA 95035 Phone: 408/739-9700
www.hcdcorp.com - sales@hcdcorp.com
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