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TAP TIMES TM
Test, Assembly & Packaging TIMES February TAP TIMES TM
January 2021, 2021
Volume 12, NUMBER 1
Test, Assembly & Packaging TIMES
Shake-up at Intel:
new year, new CEO
What do potato elds in Idaho and
semiconductor memory have in common? (page 3) Global growth will M&As set $180 billion
return to pre-COVID levels record in 2020
Trio indicted
for illegal
SRAM sales
to Russia

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TAP TIMES TM Test, Assembly & Packaging TIMES TAP TIMES TM
with Emerging Technologies
Test, Assembly & Packaging TIMES
with Emerging Technologies
Made in India: Bring your fab, get $1 billion
How COVID-19 Double-digit growth seen
is changing for smart home devices
your office
landscape
Intel plans
$35 billion
South Korea New Mexico
fl exes its investment
Chips surging
to record semiconductor Chip shortage
1.13T units muscles may persist
Researchers turn 5G this year until Q2
networks into power grids next year
IBM
Special Feature: reveals
LG exiting SOC package Research
smartphone market planarity’s impact 2nm chip advance may
on test socket design breakthrough
May-June 2021 extend
July 2021 Moore’s law
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