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January 2022 Contents

Volume 13, Number 1 NEWS
Cover Features 28-Intel in talks with Italy for new facility
29-New members join $10 billion sales club
31-Intel shows and tells advances at IEDM meeting
32-IBM, Samsung jointly develop VTFET chip
The BIG Boom! Is a new fab coming to your 35-FormFactor opens new probe card facility
city? Unprecedented amounts of money are being 34-Samsung jumps to first place in revenue over Intel
readied to construct new fabs in the U.S., Asia and Eu- 39-LBL scientists develop “smart” roof coating
rope, Editor Ron Iscoff, 3 (Sidebar: India ups the ante
for a wafer fab and Intel splurges in Malaysia, 11). Events, 25
Advertisers, 30
SEMICON Europa: a shadow of its former self.
This annual event in Munich, Germany, the governmen- Business Cards, 36-37
tal and beer capital of Bavaria, was unlike prior SEMI-
CONs, disappointingly quiet, Contributing Editor Martin Cover: With announcements by at least four major chip
Hart, 23 makers about future and current plans to enlarge and/
or build new mega-fabs, the building boom is on. The
SEMICON West: the return. COVID-19 produced a cover shows the recent expansion of Intel’s D1X fab in
SEMICON West that left exhibitors and attendees grum- Hillsboro, Oregon. (Intel photo)
bling over the wide, empty aisles and attendee shortfall, Copyright © January 2022 by TAP TIMES
Ron Iscoff, 26
Global equipment capitol spending may show
record high for 2021. When the books are closed Advertisement
on last year, the reveal, says IC Insights, will be a record Air-CavityQFN? www.MirrorSemi.com
CAPEX, 38