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TAP TIMES -49-
Micro LEDs (from 47)
velopment stage; there have been no real
quantitative achievements.
Mass transfer
Pick-and-place mass transfer equipment
capacity (using 10cm2 transfer stamps to
transfer 34*58µm Micro LED chips, pro-
duction capacity, UPH is approximately 7
million units) .
If the laser mask opening of laser mass
transfer technology is 8 square millime-
ters, production capacity is approximately
12 million units.
No matter which kind of transfer technol-
ogy is used, the mass transfer capacity of
Micro LED large-sized displays needs to
reach at least a 20 million unit level of ef-
ficiency and 99.999% yield in the future to
meet the conditions for mass commercial-
ization.
Passive matrix
Passive matrix (PM) drive design is based
on a PCB backplane with a passive drive
circuit structure, using MOSFET as the cur-
rent switching element.
Therefore, overall structure is more com-
plex and requires a wider placement area
for circuit components. In addition, when
dot pitch is reduced to less than P0.625,
the PCB backplane will encounter the chal-
lenges of line width and line space mass
production limitations and rising cost.
Thus, the current technological state of the
passive matrix (PM) drive design is more
suited to large-sized display applications
utilizing dot pitches greater than P0.625
and equipped with a Mini LED.
However, for consumer Micro LED TVs em-
ploying a dot pitch less than P0.625, ac-
tive matrix (AM) drive design will become
FEBRUARY 2022
the new direction of display design. Since
a TFT glass backplane with LTPS switching
technology is considered mature technolo-
gy by panel manufacturers, it is necessary
to adjust certain portions of the manufac-
turing process and parameters to precisely
control and drive Micro LED current.
Technical challenges
to achieve seamless tiled display splicing
technology, glass metallization and side
wire electrode glass will become further
technical challenges.
As resolution moves higher and the dot
pitch is reduced, the front circuit of TFT
glass must be guided to the back along
the side or by using through-holes.
Glass metallization is key
At this time, glass metallization technology
becomes key. Since current glass metal-
lization technology is still afflicted with
technical bottlenecks resulting in high cost
due to low yield, when these bottlenecks
are resolved with future technology, the
launch of mass production glass metalliza-
tion will become the advantage of active
matrix backplanes.
Future active matrix (AM) drive design
with Micro LED chips and seamless splic-
ing technology have the opportunity to
become the mainstream technology of
Micro LED TV development and the key to
unlocking a new wave of Micro LED large-
sized display cost optimization.
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