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TAP TIMES -12- OCTOBER 2022
High-power socket design (from 11) application-specifi c structures in the
socket to enhance the heat transfer from
Managing heat transfer in high current the device pads through to the PC board.
test sockets requires a combination of test The author is CTO of Signal Integrity Inc,
program control over sense feed back and He is a graduate of Worcester Polytechnic
active current pulse times, heat sink and Institute. His prior professional experi-
heat transfer in the socket materials and ence includes posts at LTX, Oracle and
probes. In addition, care must be given to Teradyne. Contact: ronl@signalin.com.
Market for test consumables may be worth $7.5B in 2027
LYON, France — A rapidly growing System level test is proving to be a sus-
market for probe cards, burn-in and tainable driver for test sockets. In addi-
test sockets and load boards is on tion, advanced PC boards for semicon-
track to reach more than $7.5 billion ductor testing are showing a step-change
in 2027, according to a new report upward in demand.
from the Yole Group.
Among the key growth drivers, Yole notes,
Growth for seven years in a row is the shift to 3-D stacked die and package
Yole notes suppliers of probe cards grew stacking solutions where the die and pack-
sales for the seventh year in a row, easily ages must pass more rigorous tests.
breaking through the $2.5 billion mark in
2021. Verifi cation is costly and time-consuming,
underlying demand and cost pressure is
upward, resulting in strong
test consumables sales.
Moving to the test fl oor
From the test sockets side,
the shift of system-level
testing out of the laboratory
and onto the test fl oor is
proving to be a sustainable
market driver.
Four years of double-digit
growth mean $265 million
worth of test sockets are
now sold into this market
annually. Yole projects a
14% CAGR to 2027 with a
market valued at $630 mil-
lion.
yolegroup.com
