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TAP TIMES -36- APRIL 2022
High-end packaging may The other leader, TSMC, is following
be $7.87 billion market by 2027 through with $3.05 billion of CAPEX. While
securing more business for UHD FO with
LYON, France — High-end perfor- its InFO8 solutions, TSMC is also defining
mance packaging will be a $7.87 bil- new system-level roadmaps and
lion market by 2027, with a 19% technology for 3D SoC9.
CAGR in 2021, according to Yole De-
veloppement. Its CoWoS platform offers solutions such
as RDL10 or silicon interposers,
Packaging market while its LSI platform is a direct competi-
Ultra-high density fan-out, HBM3, 3DS, tor for EMIB.
and active Si4 interposer combined are
forecast to comprise more than half of the Powerhouse
high-end performance packaging market TSMC has emerged as a high-end pack-
by 2027. aging powerhouse with leading FE11 ad-
vanced nodes allowing it to dominate next-
High-end performance packaging is creat- generation system-level packaging.
ing waves of disruption in the semiconduc-
tor supply chain, Yole maintains. Also on the podium, and boasting a $2 bil-
lion estimated CAPEX, ASE is the biggest
Intel is the top investor, with $3.5 billion. and only OSAT trying to compete with the
Its 3D chip stacking technology is Foveros, foundries and IDMs13 in packaging activ-
which consists of stacking a die on an ac- ity. With its FoCoS14 product, ASE
tive silicon interposer. is also the only OSAT with a UHD fan-out
solution at the moment.
Multi-die interconnect
An embedded multi-die interconnect Yole’s analysts also identified Samsung,
bridge is its 2.5D packaging solution, uti- just behind ASE. Samsung has its I-Cube
lizing a 55-micron bump pitch. The combi- technology, which is similar to CoWoS-
nation of Foveros and EMIB5 gives birth S15. Samsung is one of the 3D-stacked
to Co-EMIB6, used for the Ponte Vecchio memory solution leaders, providing HBM
GPU7. Intel plans to adopt hybrid bonding and 3DS. Its X-Cube will use hybrid bond-
technology for Foveros Direct. ing interconnects.
High-end performance packaging investment Keeping pace
Top players ranked by 2021 CAPEX Today, OSATs don’t
have the financial
and front-end capa-
Source: Yole bilities to keep pace
with the big play-
ers like Intel, TSMC,
and Samsung in the
advanced packag-
ing race. Therefore,
they are followers.
yole.fr
